BMC – Electronics: Overmoulding of electronic applications
Sponsor: LORENZ Kunststofftechnik GmbH
Due to their low viscosity, thermosetting molding compounds are excellently suitable for encapsulation of electronic components. These are usually sensitive, especially with respect to high internal mold pressures. However, the internal mold pressure is required to sufficiently compress the unsealed area. If these components are to be molded gently, precautions must be taken in advance to make this possible. In one project a test electronics was designed with which it was possible to investigate the influences of the process parameters on the electronics.